Design engineers seamlessly simulate integrated circuits targeting Tower’s radio frequency technologies using the suite of Keysight Electronic Design Automation software with the latest process design ...
Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...
Power electronics design is a critical aspect of modern engineering, influencing the efficiency, reliability, and performance of numerous applications. Developing circuits that meet stringent ...
Advancements in Applied Materials Semiconductor Manufacturing Equipment The world of making computer chips is always changing ...
Modeling and simulation are playing increasingly critical roles in chip development due to tighter process specs, shrinking process windows, and fierce competition to bring technologies to market ...
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency, and performance of ...
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New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...
As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
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